Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2007-07-17
2007-07-17
Chang, Yean-Hsi (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S688000
Reexamination Certificate
active
10989453
ABSTRACT:
An enclosure has a set of panels forming an outer peripheral skin. A heat exchanger wall is placed within the panels. A first fan arrangement circulates ambient air into a space within the panels and along the exterior surface of the heat exchanger wall and back into the environment. A second fan arrangement circulates air contained within the enclosure against the interior surface of the heat exchanger wall. Heat is transferred through the heat exchanger wall to the ambient air circulated by the first fan. An inner wall is placed adjacent to the interior surface of the heat exchanger wall. The space between the inner wall and the heat exchanger wall forms a space for the air within the interior of the enclosure to circulate by the second fan. The heat exchanger wall provides a barrier isolating the ambient air from the air within the enclosure, preventing dust, humidity and pollutants to enter into the interior of the cabinet in the space surrounding the electronic components.
REFERENCES:
patent: 4502099 (1985-02-01), Manes et al.
patent: 4648007 (1987-03-01), Garner
patent: 5297005 (1994-03-01), Gourdine
patent: 5422787 (1995-06-01), Gourdine
patent: 6000623 (1999-12-01), Blatti et al.
patent: 6058712 (2000-05-01), Rajasubramanian et al.
patent: 6135875 (2000-10-01), French
patent: 6269863 (2001-08-01), Wyler
patent: 6301108 (2001-10-01), Stockbridge
Jon Zuo, et al.,Advanced Thermal Architecture for Cooling of High Power Electronics, Thermacore, Inc., 2001, 7 pages.
Nelson J. Gernert,Cooling Power Semiconductors in Cabinets, Thermacore International, Inc., Jul. 25, 2001, 6 pages.
Z. J. Zuo, et al.,Compact, Double Side Impingement, Air-to-Air Heat Exchanger, Thermacore, Inc., (date unknown, circa 2001), 8 pages.
Chang Yean-Hsi
McDonnell Boehnen & Hulbert & Berghoff LLP
UTStarcom Inc.
LandOfFree
Electronics cabinet with internal air-to-air heat exchanger does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Electronics cabinet with internal air-to-air heat exchanger, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electronics cabinet with internal air-to-air heat exchanger will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3741085