Electronics assembly having multiple side cooling and method

Details Electronics assembly having multiple side cooling and method Electronics assembly having multiple side cooling and method

2007-11-13

2007-11-13

Lea-Edmonds, Lisa (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S688000, C174S015100

Reexamination Certificate

active

11262400

ABSTRACT:
An electronics assembly is provided having a substrate and at least one electronics package supported on the substrate. The electronics package also has electrical circuitry and first and second side surfaces. The assembly further includes a first heat sink device positioned in thermal communication with the first side surface of the electronics package, and a second heat sink device positioned in thermal communication with the second side surface of the electronics package.

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