Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2008-01-29
2008-01-29
Chėrvinsky, Boris (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S699000, C257S714000, C257S715000, C165S080400, C165S104260, C174S015200
Reexamination Certificate
active
11233147
ABSTRACT:
An electronics assembly is provided having a heat pipe device for cooling electronics. The assembly includes a substrate and an electronics package supported on the substrate. The assembly also includes a heat pipe device in thermal communication with an exposed surface of the electronics package. The heat pipe device includes a thermal conductive pipe having an internal volume and an open end. The heat pipe device also includes a thermal conductive end cap positioned to close the open end of the pipe. The end cap has an outer surface for receiving in thermal communication an electronics package. The heat pipe device further includes a cooling fluid disposed in the internal volume of the pipe for transferring thermal energy from the end cap to the outside environment.
REFERENCES:
patent: 5198889 (1993-03-01), Hisano et al.
patent: 5216580 (1993-06-01), Davidson et al.
patent: 5780928 (1998-07-01), Rostoker et al.
patent: 5949647 (1999-09-01), Kolman et al.
patent: 6450250 (2002-09-01), Guerrero
patent: 6639798 (2003-10-01), Jeter et al.
patent: 6793009 (2004-09-01), Sarraf
patent: 6812553 (2004-11-01), Gerbsch et al.
patent: 6827133 (2004-12-01), Luo
patent: 6873043 (2005-03-01), Oman
patent: 6938680 (2005-09-01), Garner et al.
patent: 6973964 (2005-12-01), Hul-Chun
patent: 6986383 (2006-01-01), Hsu
patent: 7013957 (2006-03-01), Hsu
patent: 7032653 (2006-04-01), Chang
patent: 7048039 (2006-05-01), Sarraf
patent: 7152667 (2006-12-01), Mochizuki et al.
patent: 2002/0080582 (2002-06-01), Chang
patent: 2005/0018402 (2005-01-01), Oman et al.
patent: 2005/0077614 (2005-04-01), Chengalva et al.
http://www.enertron-inc.com/heatpipes.html. (3 pages).
http://www.thermacore.com/hpt.htm (1 page).
Chėrvinsky Boris
Delphi Technologies Inc.
Funke Jimmy L.
LandOfFree
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