Electronics assembly and heat pipe device

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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Details

C361S699000, C257S714000, C257S715000, C165S080400, C165S104260, C174S015200

Reexamination Certificate

active

11233147

ABSTRACT:
An electronics assembly is provided having a heat pipe device for cooling electronics. The assembly includes a substrate and an electronics package supported on the substrate. The assembly also includes a heat pipe device in thermal communication with an exposed surface of the electronics package. The heat pipe device includes a thermal conductive pipe having an internal volume and an open end. The heat pipe device also includes a thermal conductive end cap positioned to close the open end of the pipe. The end cap has an outer surface for receiving in thermal communication an electronics package. The heat pipe device further includes a cooling fluid disposed in the internal volume of the pipe for transferring thermal energy from the end cap to the outside environment.

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http://www.enertron-inc.com/heatpipes.html. (3 pages).
http://www.thermacore.com/hpt.htm (1 page).

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