Electronics assembly and electronics package carrier therefor

Details Electronics assembly and electronics package carrier therefor Electronics assembly and electronics package carrier therefor

2008-01-29

2008-01-29

Gandhi, Jayprakash (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S702000, C361S719000, C165S104330, C165S185000, C174S015100

Reexamination Certificate

active

11253858

ABSTRACT:
An electronics assembly is provided having a carrier that provides a controlled height variability between electronics packages and a heat sink device. The electronics assembly includes a substrate and electronics packages connected to the substrate. The assembly also includes a heat sink device positioned in thermal communication with a first side of the electronics packages. The assembly further includes a carrier disposed between the substrate and the heat sink device. The carrier has a resilient wall that biases the electronics packages towards the heat sink device such that a controlled bond line is provided between the first side of the electronics packages and the heat sink device.

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