Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate
2006-01-31
2006-01-31
Nelms, David (Department: 2818)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
C438S055000
Reexamination Certificate
active
06991963
ABSTRACT:
A peel and stick electronic system comprises a silicone body, and at least one electronic unit operatively connected to the silicone body. The electronic system is produce by providing a silicone layer on a substrate, providing a metal layer on the silicone layer, and providing at least one electronic unit connected to the metal layer.
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Benett William J.
Davidson James Courtney
Hamilton Julie K.
Krulevitch Peter A.
Maghribi Mariam N.
Hoang Quoc
Nelms David
Scott Eddie E.
Thompson Alan H.
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