Electronic timepiece substratum

Details Electronic timepiece substratum Electronic timepiece substratum

1975-06-30

1978-02-28

Jackmon, E. S.

58 52R, 58 55, 58 88R, G04C 300, G04B 3700

Patent

active

040758257

ABSTRACT:
A watch body for an electronic watch containing an integrated circuit chip and a printed circuit board is disclosed. The watch body comprises an upper case and a bottom cover which are selectively interconnected one with the other. A lead package frame is sandwiched between the upper case and the bottom cover and contains a plurality of electrical leads disposed thereon and electrically coupled to the integrated circuit chip. The lead frame has first and second sides with the first side having a first cavity with the integrated circuit chip matingly engaged therein. The plurality of leads are disposed on the first side of the lead frame so as to surround this first cavity down the circuit chip. The second side of the lead frame has a second cavity with the printed circuit board disposed therein. By the use of the watch body of the instant invention, a significantly smaller number of components, a simpler manufacturing process is achieved.

REFERENCES:
patent: 3672155 (1972-06-01), Bergey et al.
patent: 3778999 (1973-12-01), Vuffray
patent: 3784725 (1974-01-01), Perkins
patent: 3863436 (1975-02-01), Schwarzchild et al.
patent: 3910029 (1975-10-01), Yamazaki

Affiliated with

Also associated with

Rating

Electronic timepiece substratum does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electronic timepiece substratum, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electronic timepiece substratum will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1668809