Electronic thin film circuit unit and method of making the same

Details Electronic thin film circuit unit and method of making the same Electronic thin film circuit unit and method of making the same

1976-01-27

1978-02-21

Grimley, Arthur T.

Electricity: conductors and insulators

Conduits, cables or conductors

Single duct conduits

361397, H05K 100

Patent

active

040754162

ABSTRACT:
After a valve metal layer on an insulating substrate has been metallized by sputtering on two layers of copper separated by an intermediate layer of iron, nickel or cobalt, and the combined circuit and component pattern has been etched out, followed by selectively etching away the metallization over the resistance components of the circuit, electroless deposited nickel and gold layers are successively applied to the remaining metallization and a solder layer is then applied on top by contact with liquid solder.

REFERENCES:
patent: 3423260 (1969-01-01), Heath et al.
patent: 3576722 (1971-04-01), Fennimore et al.
patent: 3621442 (1971-11-01), Racht
patent: 3625758 (1971-12-01), Stahl et al.
patent: 3634159 (1972-01-01), Croskery
patent: 3778530 (1973-12-01), Reiman
patent: 3781596 (1973-12-01), Galli et al.
patent: 3809797 (1974-05-01), McMunn et al.
IBM Technical Disclosure, Segmented Stripe Devices, vol. 13, No. 7, Dec. 1970, p. 2011.

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