Electronic thermal management

Details Electronic thermal management Electronic thermal management

2006-04-18

2006-04-18

Vortman, Anatoly (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S697000, C257S722000

Reexamination Certificate

active

07031155

ABSTRACT:
Piezoelectric fan assemblies are provided to provide a conduction path and forced convection for space-limited electronic devices in accordance with embodiments of the present invention. The fan blade of a piezoelectric fan is thermally coupled to the heat source, such as, but not limited to, the fins of a heat sink, the condenser of the heat pipe, and to the thermal mass of a heat spreader or block. The high amplitude resonant vibration of the fan blade causes formation of a high velocity unidirectional flow stream. Maximum airflow occurs on axes of the piezoelectric fan's centerline, relative to both width and height dimensions. Air intake is above and below the swept out plane of the fan blade. The air flow provides forced convection for the fan blade and, secondarily, for the heat source.

REFERENCES:
patent: 4595338 (1986-06-01), Kolm et al.
patent: 4751713 (1988-06-01), Affleck
patent: 4780062 (1988-10-01), Yamada et al.
patent: 4834619 (1989-05-01), Walton
patent: 4923000 (1990-05-01), Nelson
patent: 5008582 (1991-04-01), Tanuma et al.
patent: 5381950 (1995-01-01), Aldridge
patent: 5634351 (1997-06-01), Larson et al.
patent: 5861703 (1999-01-01), Losinski
patent: 5921757 (1999-07-01), Tsutsui et al.
patent: 6078502 (2000-06-01), Rostoker et al.
patent: 6353295 (2002-03-01), Sridhar et al.
patent: 6469381 (2002-10-01), Houle et al.
patent: 6549407 (2003-04-01), Sauciuc et al.
patent: 6561267 (2003-05-01), Sauciuc et al.
patent: 6609561 (2003-08-01), Sauciuc et al.
patent: 6636423 (2003-10-01), Rinella et al.
patent: 6639799 (2003-10-01), Prasher et al.
patent: 6646874 (2003-11-01), Pokharna et al.
patent: 6650542 (2003-11-01), Chrysler et al.
patent: 6653730 (2003-11-01), Chrysler et al.
patent: 6661660 (2003-12-01), Prasher et al.
patent: 6706562 (2004-03-01), Mahajan et al.
patent: 6713942 (2004-03-01), Raman et al.
patent: 6770966 (2004-08-01), Chrysler et al.
patent: 6785134 (2004-08-01), Maveety et al.
patent: 6795311 (2004-09-01), Pokharna et al.
patent: 2002/0074649 (2002-06-01), Chrysler et al.
patent: 2002/0080584 (2002-06-01), Prasher et al.
patent: 2003/0081383 (2003-05-01), Rinella et al.
patent: 2004/0070943 (2004-04-01), Chrysler et al.
patent: 2004/0082188 (2004-04-01), Chrysler et al.
patent: 2004/0187501 (2004-09-01), Sauciuc et al.
patent: 2004/0188817 (2004-09-01), Hua et al.
patent: 04065864 (1992-03-01), None
Sauciuc, I., et al., “Spreading in the Heat Sink Base: Phase Change Systems or Solid Metals??,” IEEE Transactions on Components and Packaging Technologies, vol. 25, No. 4, Dec. 2002, pp. 621-628.

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