Electronic tag chip

Details Electronic tag chip Electronic tag chip

2011-01-04

2011-01-04

Mandala, Victor A (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Smart card package

C257S531000, C257SE23064, C257SE23176, C257S922000

Reexamination Certificate

active

07863718

ABSTRACT:
In order to extend the communication distance of an electronic tag chip, it is required to reduce power consumption of the electronic tag chip. After having formed capacitors and diodes on an SOI (Silicon on Insulator), remove a silicon substrate of the SOI. It becomes possible to reduce the capacitors and diodes of the electronic tag chip in parasitic capacitance relative to the ground, which makes it possible to reduce the power consumption of the electronic tag chip, thereby enabling the electronic tag chip to increase in communication distance thereof.

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Usami et al, “Power LSI: an ultra small RF identification chip for individual recognition applications”, Solid-State Circuits Conference 2003, Digest of Technical Papers, ISSCC 2003 IEEE International, San Francisco, CA, Feb. 9-13, 2003.
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