Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Housing or package filled with solid or liquid electrically...
Patent
1992-08-26
1993-11-02
Jackson, Jerome
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Housing or package filled with solid or liquid electrically...
257704, H01L 2978
Patent
active
052586472
ABSTRACT:
A high acceleration object includes an electronic system which is operable at accelerations in excess of 20,000 g. Connections between integrated circuit chips and other portions of the electronic system are provided by metallization patterns disposed on polymer dielectric layers which are self-supporting across gaps between components. A high density interconnect structure is disposed within the cavity of a hermetically sealed package.
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Eichelberger Charles W.
Wojnarowski Robert J.
General Electric Company
Jackson Jerome
Krauss Geoffrey H.
Meier Stephen D.
Snyder Marvin
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