Electronic system with heat dissipation device

Details Electronic system with heat dissipation device Electronic system with heat dissipation device

2011-08-02

2011-08-02

Hoffberg, Robert J (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S679540, C361S704000, C361S709000, C361S710000, C361S818000, C165S080300, C165S185000, C174S016300

Reexamination Certificate

active

07990719

ABSTRACT:
A heat dissipation device is provided for dissipating heat generated by electronic components mounted on a printed circuit board in an electronic system. The electronic components have different heights. The heat dissipation device includes a connecting plate, at least two elastic members mounted on the connecting plate, and a heat sink having a substrate mounted on the connecting plate and located above one of the electronic components. A number of joining members extend through the printed circuit board and engage with the substrate to attach the substrate on the one electronic component on the printed circuit board. A distance between the substrate and the connecting plate is adjustable by adjusting the joining members to make the substrate intimately contact the one electronic component.

REFERENCES:
patent: 4008942 (1977-02-01), Grossi
patent: 5699229 (1997-12-01), Brownell
patent: 6078500 (2000-06-01), Beaman et al.
patent: 6246584 (2001-06-01), Lee et al.
patent: 6445583 (2002-09-01), Kline et al.
patent: 6633485 (2003-10-01), Sigl et al.
patent: 6874566 (2005-04-01), Artman et al.
patent: 7061773 (2006-06-01), Chen
patent: 7312998 (2007-12-01), Kamemoto et al.
patent: 7782617 (2010-08-01), Li et al.
patent: 2004/0201964 (2004-10-01), Sigl et al.
patent: 2005/0111196 (2005-05-01), Wang et al.
patent: 2010/0296251 (2010-11-01), Chen et al.
patent: 2011/0048681 (2011-03-01), Chen et al.
patent: 58029844 (1983-02-01), None

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