Electronic surface mount package

Details Electronic surface mount package Electronic surface mount package

1997-08-06

2002-02-05

Mai, Anh (Department: 2832)

Inductor devices

With outer casing or housing

Potted type

C336S090000, C336S192000

Reexamination Certificate

active

06344785

ABSTRACT:

BACKGROUND OF THE INVENTION
The present invention relates to an electronic surface mount package or case. Electronic surface mount packages are utilized in applications in which one or more individual toroid transformers are embodied within the surface mount package.
Wires coming off the transformers are electronically tied to pins on the package for connection to an electronic device. Typically, the electronic surface mount packages are mounted on a printed circuit board for utilization in the electronic device.
SUMMARY OF THE INVENTION
It is an object of the present invention to provide an improved electronic surface mount package.
Briefly, according to one preferred embodiment, the present invention provides a one piece construction package (with an open bottom) with one or more terminal pins molded into the package. Each of the pins have a notched post upon which a wire is wound which is from a toroid transformer carried within the package. Each of the posts are notched so that the respective wires are separated from one another so as to avoid arcing. The case is open at the bottom which prevents harm from expansion or cracking.
Other objects, features, and advantages of the present invention will become apparent from the following detailed description when taken in conjunction with the accompanying drawings.


REFERENCES:
patent: 3721747 (1973-03-01), Renskers
patent: 5034854 (1991-07-01), Matsumura et al.
patent: 0 490 438 (1992-06-01), None
McCormick; Surface Mount Transformers: A New Packaging Approach; Surface Mount Technology; Feb. 1993; pp. 27-31.
Wyns et al.; PSPICE Simulations and 3D-PCB Transformers for ZVS Full Bridge Converters; The European Power Electronics Association; 1993; pp. 208-214.
EPE'93 Fifth European Conference; Power Electronics and Applications; vol. 3: Electronic Power Supply System; Sep. 13-16, 1993; pp. 215.
Davis; SMT Passive Components Fit Power Electronics Applications; PCIM; Jun. 1993; vol. 19; No. 6; pp. 20-28 and 90.
Osawa; A Superminiaturized Double-Balanced SMT Mixer-Modulator; Microwave Journal; Feb. 1994; pp. 90-97.
Lyons et al.; Printed Circuit Board Magnetics: A New Approach to the Mass Production of Toroidal Transformers; ISHM '95 Proceedings; pp. 53-58.
Derebail et al.; Knowledge Based Adhesive Selection for SMT Assemblies; Proceedings 1995 International Symposium on Microelectronics; Oct. 24-26, 1995; vol. 2649; pp. 1024-1035.

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