Inductor devices – With outer casing or housing – Potted type
Reexamination Certificate
1997-11-24
2001-10-02
Mai, Anh (Department: 2832)
Inductor devices
With outer casing or housing
Potted type
C336S192000, C336S229000, C336S065000, C361S821000
Reexamination Certificate
active
06297721
ABSTRACT:
BACKGROUND OF THE INVENTION
The present invention relates to an electronic surface mount package or case. Electronic surface mount packages are utilized in applications in which one or more individual toroid transformers are embodied within the surface mount package.
Wires coming off the transformers are electronically tied to pins on the package for connection to an electronic device. Typically, the electronic surface mount packages are mounted on a printed circuit board for utilization in the electronic device.
It is widely known in the local area magnetic industry that when surface mount toroidal magnetics which are encapsulated in hard plastics go through infra-red soldering processes, the magnetic components (ferrite) can expand significantly. When using a hard epoxy type material, it has been found that the magnetic component expansion can often cause cracking of the package or case, which makes the part unusable. In view of the foregoing, it would be highly desirable to provide an improved electronic surface mount package which avoids the cracking and expansion problems described above.
SUMMARY OF THE INVENTION
It is an object of the present invention to provide an improved electronic surface mount package.
Briefly, according to one preferred embodiment, the present invention provides a one piece construction package (with an open bottom) with one or more terminal pins molded into the package. Each of the pins have a notched post upon which a wire is wound and soldered. The wire which is wound and soldered around each terminal pin/post is from a respective toroid transformer carried within the package. Each of the posts are notched so that the respective wires are separated from one another so as to avoid arcing. The case is open at the bottom which prevents cracking and allows for the toroidal expansion. The present invention also includes a reinforcement beam that is disposed laterally or sidewise across the bottom of the package to provide extra support in the mechanical strength of the case.
Other objects, features, and advantages of the present invention will become apparent from the following detailed description when taken in conjunction with the accompanying drawings.
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Wyns et al.; PSPICE Simulations and 3D-PCB Transformers for ZVS Full Bridge Converters; The European Power Electronics Association; 1993; pp. 208-214.
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Lyons et al.; Printed Circuit Board Magnetics: A New Approach to the Mass Production of Toroidal Transformers; ISHM '95 Proceedings; pp. 53-58.
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Heaton James W.
Heaton Jeffrey
Lam Robert Loke Hang
Lu Peter
Pao Peter Loh Hang
Halo Electronics, Inc.
Mai Anh
Trial & Technology Law Group
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