Electronic surface mount package

Inductor devices – With outer casing or housing – Potted type

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Details

174 524, 336 65, 336192, 336229, 361821, H01F 1510, H01F 2702

Patent

active

056569858

ABSTRACT:
An electronic surface mount package provides a one piece construction package (with an open bottom) with one or more terminal pins molded into the package. Each of the pins have a notched post upon which a wire is wound which is from a toroid transformer carried within the package. Each of the posts are notched so their respective wires are separate from one another so as to prevent arcing. The case is opened at the bottom which prevents harm from expansion or cracking.

REFERENCES:
patent: 4205291 (1980-05-01), Flemtee
patent: 5034854 (1991-07-01), Sumun et al.
patent: 5307041 (1994-04-01), Kato et al.

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