Electronic surface mount device

Details Electronic surface mount device Electronic surface mount device

1995-06-23

1996-12-03

Saadat, Mahshid

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257675, 257676, 257696, 257672, H01L 23495, H01L 2348

Patent

active

055811183

ABSTRACT:
A surface mount package (10) includes a leadframe (14) facing away from the mounting surface such that the primary heat path is away from the mounting surface. The package may be a modified TO-220, wherein the tab (16) of the leadframe is bent down toward the mounting surface, and the leads (20) are bent down and under the package. Such an embodiment provides for a small footprint and is relatively easy to manufacture.

REFERENCES:
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patent: 4270138 (1981-05-01), Desmond
patent: 4542439 (1985-09-01), Dick
patent: 4589010 (1986-05-01), Tateno et al.
patent: 4647959 (1987-03-01), Smith
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patent: 4971196 (1990-11-01), Kitamura et al.
patent: 5018005 (1991-05-01), Lin et al.
patent: 5095626 (1992-03-01), Kitamura et al.
patent: 5305179 (1994-04-01), Sono et al.
Motorola, Inc., TO-220 Leadform Options, 1990, Publication No. BR370/D, Rev 2.
Motorola, Inc., Rectifier Applications Handbook, 1993, Publication No. HB2145/D, pp. 280-283.

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