Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate
2006-03-21
2006-03-21
Williams, Alexander Oscar (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Multiple housings
C257S723000, C257S686000, C257S777000, C257S696000, C257S698000, C257S203000, C257S211000, C257S207000, C257S208000, C257S758000, C257S700000, C257S701000, C257S668000
Reexamination Certificate
active
07015570
ABSTRACT:
A multi-connect substrate, module including the substrate and an Integrated Circuit (IC) chip packaged in the module. The multi-connect substrate includes a multilayered substrate with at least one edge terminal array and one inboard terminal array on one face. An exterior terminal array is located on an opposite face. Signal wires pass through the multilayered substrate, connecting edge terminals to inboard terminals and inboard terminals with a exterior array terminals.
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Emma Philip G.
Zingher Arthur R.
International Business Machines Corp.
Karra, Esq. Satheesh K.
Law Office of Charles W. Peterson, Jr.
Percello, Esq. Louis J.
Williams Alexander Oscar
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