Electronic substrate multiple location conductor attachment tech

Details Electronic substrate multiple location conductor attachment tech Electronic substrate multiple location conductor attachment tech

1993-06-21

1994-06-21

Bradley, P. Autsin

Metal fusion bonding

With means to juxtapose and bond plural workpieces

Plural discrete workpieces

228 17, 2281731, 29839, 29845, 29753, B23K 120, H01K 800

Patent

active

053222040

ABSTRACT:
A conductor attachment wherein each conductor is mounted on a dielectric tape and has an attachment portion that is supported by the tape to an adjacent location a uniform distance from the bonding location and that contacts on a level with the plane of the underside of the tape. One conductor supporting tape has portions of the tape that extend into a central contacting area opening to contact locations at contacting pads in rows remote from the edge. Another supporting tape has window openings at the contacting locations. The conductor ends are brought into the level of the underside of the tape by a manufacturing rolling operation between an elastomer surface roller and a solid backing roller.

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patent: 5028983 (1991-07-01), Bickford et al.

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