Electronic substrate multiple location conductor attachment tech

Details Electronic substrate multiple location conductor attachment tech Electronic substrate multiple location conductor attachment tech

1990-10-24

1992-05-26

James, Andrew J.

357 68, 357 65, 357 80, H01L 2348, H01L 2944, H01L 2952, H01L 2960

Patent

active

051172755

ABSTRACT:
A conductor attachment wherein each conductor is mounted on a dielectric tape and has an attachment portion that is supported by the tape to an adjacent location a uniform distance from the bonding location and that contacts on a level with the plane of the underside of the tape. One conductor supporting tape has portions of the tape that extend into a central contacting area opening to contact locations at contacting pads in rows remote from the edge. Another supporting tape has window openings at the contacting locations. The conductor ends are brought into the level of the underside of the tape by a manufacturing rolling operation between an elastomer surface roller and a solid backing roller.

REFERENCES:
patent: 4166312 (1979-09-01), Harigane et al.
patent: 4361173 (1982-11-01), Storimans
patent: 4538210 (1985-08-01), Schaller
patent: 4573501 (1986-03-01), Furuya
patent: 4949158 (1990-08-01), Ueda
patent: 4972253 (1990-11-01), Palino et al.
patent: 5006917 (1991-04-01), Kang et al.
Microelectronics Packaging Handbook edited by Rao R. Tummala and Eugene J. Rymaszewski, published by Van Nostrand, (1989), pp. 409-431.
IBM Technical Disclosure Bulletin vol. 32, No. 11, Apr. 1990, pp. 246 and 247 "QUADTAB: A Technique for the Simplification and Enhancement of TAB" by Honeycutt et al.
IBM Technical Disclosure Bulletin vol. 14, No. 8, Jan. 1972, p. 2435 "Connection of Discrete Leads to Packaged Circuits" by W. E. Dougherty.

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