Electronic stack module

Details Electronic stack module Electronic stack module

1997-12-03

1999-06-08

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361742, 361803, 361804, 439 65, 439 69, 439 74, 439876, H01R 909, H01R 402

Patent

active

059108851

ABSTRACT:
An electronic stack module is disclosed comprising two or more substrates having upper and lower surfaces with one or more electronic components disposed on the surfaces and electrically connected to connector pads disposed in a predetermined pattern at the substrate edges. A plurality of clip leads are electrically attached to the connector pads, where each clip lead comprises a clip section, a standoff section of specified length, and a mounting section, the clip section configured to frictionally engage both upper and lower substrate surfaces. Stacking of substrates is accomplished by aligning and bonding clip sections of one substrate to corresponding mating sections of the adjacent substrate.

REFERENCES:
patent: 4245876 (1981-01-01), Ritchie et al.
patent: 4555151 (1985-11-01), Neese et al.
patent: 4592617 (1986-06-01), Seidler
patent: 4647126 (1987-03-01), Sobota, Jr.
patent: 4739125 (1988-04-01), Watanabe et al.
patent: 4873615 (1989-10-01), Grabbe
patent: 5191404 (1993-03-01), Wu et al.

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