Electrical transmission or interconnection systems – Vehicle mounted systems – Automobile
Reexamination Certificate
2000-02-23
2001-08-21
Jackson, Stephen W. (Department: 2836)
Electrical transmission or interconnection systems
Vehicle mounted systems
Automobile
C307S131000
Reexamination Certificate
active
06278199
ABSTRACT:
BACKGROUND OF THE INVENTION
The present invention relates to a semiconductor module, specifically a compact switch module that exhibits good thermal energy dissipation characteristics and is capable of carrying a very large current.
High power applications require that the circuits delivering these currents be capable of carrying very large amounts of current. Certain applications demand current capabilities in excess of 1000 Amperes. A device typically found in such circuits is a switch. For example, the electronic control circuitry for an automotive turbocharger, supercharger, or super-turbocharger requires switching these extremely large currents. Circuit switches are generally available as either mechanical switches or electronic switches. Mechanical switches typically employ a number of metallic contact points which are connected or disconnected by physically moving, either manually or automatically, a conductor between the contact points. Mechanical switches wear out and are prone to breakage.
Electronic switches typically employ transistors, which can be switched on and off by applying a base current or a gate voltage, depending on the type of transistor. Power metal oxide field effect transistors (MOSFETs) and insulated gate bipolar transistors (IGETs) (hereinafter FETs) are used as switching transistors because, among their other useful characteristics, they are easily paralleled and are able to carry large currents. However, because of their resistive characteristics, FET based switches are prone to heating. This becomes problematic when switching high current loads. In addition, high current switching applications employ the use of multiple FETs, whose respective gates, drains and sources are connected in parallel. These parallel configurations require large modules to house the FETs. The modules also require large heatsinks to dissipate the heat, further increasing overall package size.
It is desirable to have a FET based switch module which can reliably switch a large current, is small, exhibits good thermal management properties and can be arranged to have low inductance.
SUMMARY OF THE INVENTION
It is an object of the present invention to provide a field effect transistor (FET) single switch module housing at least one FET, and preferably a plurality of parallel FETS, in die form such that the module is compact, rugged, and is capable of switching a very large current while maintaining good thermal energy dissipation characteristics.
The present invention provides an electronic switch module in which there is an interlocking base plate. The base plate includes a first electrically conductive element and a second electrically conductive element arranged to interlock with but not physically contact the first electrically conductive element. The first electrically conductive element and the second electrically conductive element are arranged in a planar relationship with respect to each other. A housing defines an inner volume and is comprised of an insulating material, the housing being formed to affix the first electrically conductive element and the second electrically conductive element in the planar arrangement. At least one semiconductor die has a first side mounted to and in electrical contact with one of the first and second electrically conductive elements and a second side electrically coupled to the other of the first and second electrically conductive elements.
According to another aspect of the invention the first and second electrically conductive elements each include nibs arranged on at least a part of a periphery of the first and second electrically conductive elements.
As still yet another aspect of the invention, the nibs are molded within the insulating material.
Another aspect of the invention provides nibs extending upward and outward from at least one of the first and second electrically conductive elements.
As still another aspect of the invention, the first and second electrically conductive elements each include a first side and a second side opposite the first side, at least a part of the first side of the first electrically conductive element and at least a part of the first side of the second electrically conductive element is wider than their respective second sides.
According to another aspect of the invention, the nibs are symmetrical around a plane centrally positioned between the first side and the second side of each of the first and second electrically conductive elements.
According to still yet another aspect of the invention, the thickness of the nibs is less than the thickness of the first and second electrically conductive elements.
As still another aspect of the invention, the nibs along respective interlocking portions form an approximately contiguous piece longitudinally along the at least a part of the periphery of the first and second electrically conductive elements.
The invention also provides another aspect in which the nibs are approximately contiguous along the periphery of the interlocking portion of both of the first and second electrically conductive elements.
The invention also provides an aspect in which the semiconductor devices are field effect transistors.
Still another aspect of the present invention includes a printed circuit board in which the printed circuit board is positioned within the inner volume of the housing and is in electrical contact with the at least one semiconductor die.
As still another aspect, the module is incorporated within an internal combustion engine.
As still yet another aspect, the field effect transistors are implemented on size four dice and the module is arranged to switch an electric current in excess of one thousand amperes.
As still another aspect of the present invention, a plurality of modules are electrically interconnected to create a switch interconnected to create a large-scale three phase inverter structure.
The present invention also provides an electronic switch module for use in an internal combustion engine in which there is an interlocking base plate which includes an electrically conductive plug element and an electrically conductive receptacle element arranged to interlock with but not physically contact the electrically conductive plug element. The electrically conductive plug element and the electrically conductive receptacle element are arranged in a planar relationship with respect to each other. A housing defines an inner volume and is comprised of an insulating material, the housing being formed to affix the electrically conductive plug element and the electrically conductive receptacle element in the planar arrangement. At least one semiconductor die has a first side which is mounted to and is in electrical contact with one of the electrically conductive plug and receptacle elements and has a second side electrically coupled to the other of the electrically conductive plug and receptacle elements.
As another aspect of the invention, the electrically conductive plug element is formed in the shape of a “T” and the electrically conductive receptacle element is formed in the shape of a “U”.
As still another aspect of the invention, the at least one field effect transistor is mounted to the electrically conductive plug element.
As still yet another aspect of the invention, the at least one field effect transistor is mounted to the electrically conductive receptacle element.
According to another aspect of the present invention, the module further includes a printed circuit board which is:
positioned within the inner volume of the housing;
in electrical contact with the at least one semiconductor die; and
mounted to the electrically conductive plug element.
Other features and advantages of the present invention will become apparent from the following description of the invention which refers to the accompanying drawings.
REFERENCES:
patent: 5297001 (1994-03-01), Sterling
patent: 5563447 (1996-10-01), Lake et al.
patent: 5821618 (1998-10-01), Graf et al.
patent: 6166464 (2000-12-01), Grant
Grant William
Polack Joshua
International Rectifier Corp.
Jackson Stephen W.
Ostrolenk, Faber, Gerb & Soffen, LL
Polk Sharon
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