Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate
2006-06-06
2006-06-06
Thompson, Craig A. (Department: 2629)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
C324S754120
Reexamination Certificate
active
07056764
ABSTRACT:
An electronic sensor device has at least one sensor component, which bears on a bearing base of a rewiring structure. Contact areas of the sensor component are electrically conductively connected to contact pads of the rewiring structure. External contact areas of the rewiring structure are led outward from a housing for the electrical contact-connection of the electronic sensor device. A method is also described for producing the electronic sensor device.
REFERENCES:
patent: 5495450 (1996-02-01), Zollo et al.
patent: 6119052 (2000-09-01), Guenther et al.
patent: 5503780 (2003-01-01), Glenn et al.
patent: 6617674 (2003-09-01), Becker et al.
patent: 63 296 252 (1988-12-01), None
patent: 9-119875 (1997-05-01), None
patent: 09 304 211 (1997-11-01), None
patent: 11 097 612 (1999-04-01), None
patent: 2001 177 039 (2001-06-01), None
Auburger Albert
Paulus Stefan
Stadler Bernd
Theuss Horst
Greenberg Laurence A.
Harrison Monica D
Infineon - Technologies AG
Locher Ralph E.
Stemer Werner H.
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