Electronic sensor assembly having metal interconnections isolate

Fishing – trapping – and vermin destroying

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437901, 1566291, 1566571, H01L 2100

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active

056460724

ABSTRACT:
A pressure sensor (32) having a transducer (34) disposed on a top surface of an active die (38). The transducer has a doped region (42), the active die is disposed on a mounting substrate (70), and an interconnect opening (48) is disposed at an edge (90) of the active die. A metal layer (50) is disposed in the interconnect opening and on the top surface of the active die to be in electrical contact with the doped region. A conductive bump (76) is disposed on the mounting substrate in electrical contact with the metal layer and a conductive trace (74) on the mounting substrate.

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"Fabrication Technology for Wafer-Through Hole Interconnections and Three-Dimensional Stacks of Chips and Wafers," Linder et al., Proceedings, IEEE, Micro Electro Mechanical Systems, IEEE Robotics and Automation Society, Oiso, Japan, Jan. 25-28, pp. 349-354.
"A pH-ISFET and an Integrated pH-Pressure Sensor with Back-side Contacts," Van Den Vlekkert et al., Sensors and Actuators, 14, (1988), pp. 165-176.

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