Electronic semiconductor device having a thermal spreader

Details Electronic semiconductor device having a thermal spreader Electronic semiconductor device having a thermal spreader

2005-11-29

2005-11-29

Thompson, Craig A. (Department: 2813)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S106000, C438S122000, C438S460000

Reexamination Certificate

active

06969637

ABSTRACT:
The electronic device is formed in a die including a body of semiconductor material having a first face covered by a covering structure and a second face. An integral thermal spreader of metal is grown galvanically on the second face during the manufacture of a wafer, prior to cutting into dice. The covering structure comprises a passivation region and a protective region of opaque polyimide; the protective region and the passivation region are opened above the contact pads for the passage of leads.

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