Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent
1993-02-22
1995-01-24
Hille, Rolf
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
257698, 361784, 361785, H01L 2310, H01L 2332
Patent
active
053844840
ABSTRACT:
An electronic read-only memory module having an inner casing and an outer casing cap. The inner casing is located on a secondary circuit board from whose edge which projects laterally from the inner casing project contact elements for producing a plug contact with contact counterelements located on a circuit board of a device, which is to be equipped with the ROM module. The outer casing cap has lateral internal gaps which protectively receive the contact elements. Due to the fact that the free ends of the contact elements are set back inwardly with respect to the open edge of the outer casing cap, the contact elements are protected against damage. This also greatly simplifies the loading of a device with the ROM module, because as a result of a simple plugging movement numerous contact elements can be brought into reliable contact with the contact counterelements.
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IBMTDB, Chang et al., Personalizing Prepackaged Semiconductor Devices, vol. 17, No. 7, Dec. 1974, pp. 1950-1951.
Brown Peter Toby
Frama AG
Hille Rolf
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