Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1998-06-15
2000-12-26
Thompson, Gregory
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
165 804, 361699, 361701, H05K 720
Patent
active
061669032
DESCRIPTION:
BRIEF SUMMARY
BACKGROUND OF THE INVENTION
In electronic power modules, it is necessary to cool electronic power components that are at high potentials.
The term "electronic power components" covers individual components, namely: semiconductor chips, e.g. silicon chips.
One conventional cooling means comprises soldering the component to a copper track, itself mounted on an electrically insulating ceramic of the AlN type or the equivalent, for the purpose of insulating the component and the copper track which are at high potential from the soleplate and the cooling device which are at ground potential.
That complex multilayer structure is well adapted to electrically insulating the power component, however the numerous solder, adhesive, and grease interfaces used for making the multilayer structure combine to constitute considerable total thermal resistance which reduces the ability of the structure suitably to remove the heat losses coming from the power components. In addition, the greater the potential, the thicker the dielectric ceramic layer needs to be, and unfortunately, it is known that ceramic dielectrics are not good conductors of heat.
It is also very difficult to find a material that is a good conductor of heat, a dielectric, and of low cost. For example, diamond satisfies the technical requirements, but its exorbitant purchase price disqualifies it for applications that require large areas and long production runs.
Another drawback of prior art power electronic modules is their poor ergonomy in a multi-module configuration. That is to say existing modules do not have simple means for making inter-module connections easily so as to build up multi-module electronic power systems.
SUMMARY OF THE INVENTION
An object of the present invention is to propose an electronic power module in which the dielectric materials used do not serve in any way as an interface for conveying heat and where the heat-conducting materials do not perform any electrical insulation function.
Another object of the present invention is to propose modules of improved ergonomy for making multi-module systems.
To this end, the invention provides an electronic power module comprising electronic power components each having at least one contact face, control connections for connecting the components to a control module, power connections for conveying power between the components and/or other modules, and at least one metal heat exchanger for removing heat power dissipated in the electronic power components. According to the invention, the contact faces of said electronic power components are directly mounted on and bonded to the metal heat exchanger, the metal heat exchanger being at the same potential as the contact faces of the electronic power components.
According to a dependent characteristic, the electronic power components and the metal heat exchanger are embedded in a dielectric material.
Advantageously, the metal heat exchanger includes passages through which a dielectric heat-conveying fluid flows, said passages being connected via dielectric pipes to a cooler/recycler at ground potential for the dielectric fluid.
In an embodiment, the control connections are independent and are electrically insulated from the metal heat exchanger.
Either the control connections are connected to a control busbar disposed parallel to the metal heat exchanger, or the control connections are mounted on the heat exchanger and are electrically insulated therefrom by a dielectric plate.
The power connections may be connected directly to the metal heat exchanger.
In another embodiment, the electronic power module comprises both a longitudinal power connection busbar independent from the metal heat exchanger and positioned to one side of the metal heat exchanger, and an electrically insulating element interposed between said power connection busbar and said metal heat exchanger.
Advantageously, the control connections are integrated on said interposed electrically insulating element.
In a third embodiment, the electronic power components are directly moun
REFERENCES:
patent: 5111280 (1992-05-01), Iversen
patent: 5203399 (1993-04-01), Koizumi
patent: 5526231 (1996-06-01), Arz et al.
Patent Abstracts of Japan. vol. 017. No. 504 (E-1430) Sep. 10, 1993 corresponding to JP 05 192487 A (Osaka Denki Co LTD) May 25, 1993.
Broqua Nadia
Cazabat Stephane
Crouzy Sophie
Estop Pascal
Petitbon Alain
Alcatel
Thompson Gregory
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