Electronic power device heatsink clamping system

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

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Details

257718, 257719, 257712, 361726, 361702, 361703, 361704, 361709, H01L 2334

Patent

active

061440922

ABSTRACT:
In a preferred embodiment, an electronic power device heatsink clamping system, including: a heatsink; at least one electronic power device disposed adjacent a side of the heatsink; at least one clamping spring, having first and second ends, disposed so as to press the at least one electronic device against the side of the heatsink; and a pressure enhancing member pressing against the at least one clamping spring, intermediate the first and second ends, causing the clamping spring to act as a simple beam spring.

REFERENCES:
patent: 4872089 (1989-10-01), Ocken et al.
patent: 4972294 (1990-11-01), Moses, Jr. et al.
patent: 5309979 (1994-05-01), Brauer

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