Electronic parts packaging structure having mutually...

Details Electronic parts packaging structure having mutually... Electronic parts packaging structure having mutually...

2005-09-13

2005-09-13

Williams, Alexander Oscar (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S758000, C257S701000, C257S778000, C257S737000, C257S738000, C257S685000, C257S686000, C257S723000, C257S777000, C257S774000, C257S680000

Reexamination Certificate

active

06943442

ABSTRACT:
There are included a wiring substrate including a predetermined wiring pattern, an electronic parts connection terminal on an element forming surface of which is flip-chip connected to the wiring pattern, an insulating film for covering the electronic parts, a via hole formed in a predetermined portion of the electronic parts and the insulating film on the connection terminal, and an overlying wiring pattern formed on the insulating film and connected to the connection terminal via the via hole.

REFERENCES:
patent: 5949140 (1999-09-01), Nishi et al.
patent: 2001/0004130 (2001-06-01), Higashi et al.
patent: 2001/0008794 (2001-07-01), Akagawa
patent: 2002/0027295 (2002-03-01), Kikuma et al.
patent: 2002/0127839 (2002-09-01), Umetsu et al.
patent: 2002/0160598 (2002-10-01), Kong
patent: 1 248 295 (2002-10-01), None
patent: 61-150250 (1986-07-01), None
patent: 2000-323645 (2000-11-01), None
patent: 2001-177045 (2001-06-01), None
patent: 2001-196525 (2001-07-01), None
Copy of European Patent Office Communication for corresponding European Patent Application No. 03257626 dated Mar. 29, 2004.

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