Electronic parts packaging structure and method of...

Details Electronic parts packaging structure and method of... Electronic parts packaging structure and method of...

2007-10-23

2007-10-23

Patel, Ishwar (I. B.) (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S262000

Reexamination Certificate

active

11090028

ABSTRACT:
An electronic parts packaging structure of the present invention includes a core substrate having such a structure that a recess portion is provided by forming a prepreg insulating layer having an opening portion therein on a resin layer, and an electronic parts mounted on a bottom portion of the recess portion of the core substrate such that a connection pad of the electronic parts is directed upward, and also, such a structure may be employed that the electronic parts is embedded in a resin layer of a core substrate having a structure that the resin layer is formed on the prepreg insulating layer.

REFERENCES:
patent: 6038133 (2000-03-01), Nakatani et al.
patent: 6329610 (2001-12-01), Takubo et al.
patent: 6538210 (2003-03-01), Sugaya et al.
patent: 6742250 (2004-06-01), Takahashi
patent: 6822170 (2004-11-01), Takeuchi et al.
patent: 6841740 (2005-01-01), Ogawa et al.
patent: 6876091 (2005-04-01), Takeuchi et al.
patent: 6909054 (2005-06-01), Sakamoto et al.
patent: 6914322 (2005-07-01), Iijima et al.
patent: 6930392 (2005-08-01), Sunohara et al.
patent: 2004/0014317 (2004-01-01), Sakamoto et al.
patent: 2000-323645 (2000-11-01), None
patent: 2002-170840 (2002-06-01), None

Affiliated with

Also associated with

Rating

Electronic parts packaging structure and method of... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electronic parts packaging structure and method of..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electronic parts packaging structure and method of... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3895724