Electronic parts packaging structure and method of...

Details Electronic parts packaging structure and method of... Electronic parts packaging structure and method of...

2007-05-15

2007-05-15

Reichard, Dean A. (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S261000, C174S262000

Reexamination Certificate

active

10717591

ABSTRACT:
There is provided a electronic parts packaging structure that includes a mounted body on which an electronic parts is mounted, the electronic parts having a connection pad, which has an etching stopper film (a copper film, a gold film, a silver film, or a conductive past film) as an uppermost film, and mounted on the mounted body to direct the connection pad upward, an interlayer insulating film for covering the electronic parts, a via hole formed in the insulating film on the connection pad of the electronic parts, and a wiring pattern connected to the connection pad via the via hole.

REFERENCES:
patent: 5960308 (1999-09-01), Akagawa et al.
patent: 2001/0010627 (2001-08-01), Akagawa
patent: 2001/0011767 (2001-08-01), Osawa et al.
patent: 2003/0218249 (2003-11-01), Ho et al.

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