Electronic parts packaging structure and method of...

Details Electronic parts packaging structure and method of... Electronic parts packaging structure and method of...

2005-08-16

2005-08-16

Le, Thao P. (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified material other than unalloyed aluminum

C257S778000, C438S622000

Reexamination Certificate

active

06930392

ABSTRACT:
There are provided the steps of forming a wiring pattern in an area except packaging area on a mounted body, the package area in which electronic parts is mounted, mounting the electronic parts in the packaging area of the mounted body to direct a surface of the electronic parts, of which a connection terminal is formed, upward, and forming an insulating film which covers the electronic parts and the wiring pattern.

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Copy of European Patent Office Communication including European Search Report for corresponding European Application No. 03257077 dated Feb. 26, 2004.

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