Electronic parts mounting method and device therefor

Details Electronic parts mounting method and device therefor Electronic parts mounting method and device therefor

2005-08-09

2005-08-09

Haran, John T. (Department: 1733)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

C029S832000

Reexamination Certificate

active

06926796

ABSTRACT:
A chip is bonded on a circuit board by aligning in position bumps with board electrodes with interposition of an anisotropic conductive layer between the chip and the circuit board. The anisotropic conductive layer is a mixture of an insulating resin, conductive particles and an inorganic filler. The chip is pressed against the board with a pressure force of not smaller than 20 gf per bump by virtue of a tool, while warp of the chip and the board is corrected, the bumps are compressed, and the insulating resin is hardened.

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