Electronic parts mounting method and device therefor

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

Reexamination Certificate

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Details

C029S832000

Reexamination Certificate

active

06926796

ABSTRACT:
A chip is bonded on a circuit board by aligning in position bumps with board electrodes with interposition of an anisotropic conductive layer between the chip and the circuit board. The anisotropic conductive layer is a mixture of an insulating resin, conductive particles and an inorganic filler. The chip is pressed against the board with a pressure force of not smaller than 20 gf per bump by virtue of a tool, while warp of the chip and the board is corrected, the bumps are compressed, and the insulating resin is hardened.

REFERENCES:
patent: 4811081 (1989-03-01), Lyden
patent: 5407864 (1995-04-01), Kim
patent: 5686703 (1997-11-01), Yamaguchi
patent: 5918113 (1999-06-01), Higashi et al.
patent: 6112969 (2000-09-01), Horibe et al.
patent: 6207549 (2001-03-01), Higashi et al.
patent: 6223429 (2001-05-01), Kaneda et al.
patent: 6458236 (2002-10-01), Takeshita et al.
patent: 6589376 (2003-07-01), Davis et al.
patent: 0 622 149 (1994-11-01), None
patent: 834919 (1998-04-01), None
patent: 954208 (1999-11-01), None
patent: 62-6652 (1987-02-01), None
patent: 5-013119 (1993-01-01), None
patent: 6-66355 (1994-08-01), None
patent: 6-333965 (1994-12-01), None
patent: 8-222599 (1996-08-01), None
patent: 8-298271 (1996-11-01), None
patent: 10-004097 (1998-01-01), None
patent: 10-013002 (1998-01-01), None
patent: 5-070750 (1998-03-01), None
patent: 10-084014 (1998-03-01), None
patent: 10-256306 (1998-09-01), None
patent: 10-308417 (1998-11-01), None
patent: 10-321669 (1998-12-01), None
patent: 2000-223534 (2000-08-01), None
patent: 98/30073 (1998-07-01), None

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