Electronic parts mounting apparatus

Metal working – Means to assemble or disassemble – Means to assemble electrical device

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Details

29760, 361401, H05K 118, H05K 330, B23P 1900

Patent

active

052050327

ABSTRACT:
An electronic parts mounting device according to this invention is characterized by including a mount body which is obtained by bonding at least two substrates each having a predetermined thicknesses and a smooth surface and which has at least one bonding portion, the mount body having at least one recessed portion selectively formed in one exposed surface of the mount body to reach the bonding portion, and the recessed portion having a tapered shape widened from the bonding portion to the exposed surface, and an electronic part mounted in the recessed portion.

REFERENCES:
patent: 3520054 (1970-07-01), Pensack et al.
patent: 4627161 (1986-12-01), Cushman
patent: 4860442 (1989-08-01), Ainsworth et al.
patent: 4875285 (1989-10-01), Ogata et al.
patent: 5046238 (1991-08-01), Daigle et al.

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