Electronic parts loaded module including thermal stress absorbin

Details Electronic parts loaded module including thermal stress absorbin Electronic parts loaded module including thermal stress absorbin

1992-05-08

1995-06-06

Jackson, Jerome

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified configuration

257692, 257784, 257780, H01L 2348, H01L 2944, H01L 2952, H01L 2960

Patent

active

054225167

ABSTRACT:
An electronic parts loaded module comprises a circuit board having electronic parts connected thereto via a plurality of projecting electrodes, in which two or more of the plurality of projecting electrodes for connecting the electronic parts have a narrowed portion between one end adjacent to the boundary for connection with the electronic parts and the other end adjacent to the boundary for connection with the board, the narrowed portion having a cross-section which has different dimensions in crossing directions, or a minor axis and a major axis different in length from each other. The projecting electrodes are disposed in a manner as the larger dimension or the major axis being aligned along the periphery or the side of the electronic parts, or as surrounding the central area of the surface, on which the electronic parts are loaded. The module can be used in IC cards and liquid crystal display apparatuses and the like.

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patent: 4250520 (1981-02-01), Denlinger
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patent: 4930001 (1990-05-01), Williams
patent: 5151773 (1992-09-01), Matsui et al.
patent: 5189507 (1993-02-01), Carlomagno et al.
IBM Technical Disclosure Bulletin, vol. 33, No. 7, Dec. 1990: "Direct Chip Bonding for Liquid Crystal Display".
IBM Technical Disclosure Bulletin, vol. 24, No. 5, Oct. 1981: "Chip-to-Substrate Interconnection".

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