Electronic parts built-in substrate and method of...

Details Electronic parts built-in substrate and method of... Electronic parts built-in substrate and method of...

2007-04-03

2007-04-03

Cao, Phat X. (Department: 2814)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S108000

Reexamination Certificate

active

11049958

ABSTRACT:
An electronic parts built-in substrate of the present invention includes a wiring substrate having connecting pads, a first electronic parts a bump of which is flip-chip connected to the connecting pad, a second electronic parts having a larger area than an area of the first electronic parts a bump of which is flip-chip connected to the connecting pad arranged on an outside of a periphery of the first electronic parts and which is packaged at a predetermined interval over the first electronic parts, and a filling insulating body filled in a clearance between the first electronic parts and the wiring substrate and clearances between the second electronic parts and the first electronic parts and the wiring substrate, wherein the first electronic parts is buried in the filling insulating body.

REFERENCES:
patent: 5646828 (1997-07-01), Degani et al.
patent: 6335571 (2002-01-01), Capote et al.
patent: 6369448 (2002-04-01), McCormick
patent: 2004/0036152 (2004-02-01), Harper et al.
patent: 11-274734 (1999-10-01), None

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