Metal fusion bonding – Process – With measuring – testing – indicating – inspecting – or...
Reexamination Certificate
2006-05-09
2006-05-09
Johnson, Jonathan (Department: 1725)
Metal fusion bonding
Process
With measuring, testing, indicating, inspecting, or...
C324S754090, C324S765010
Reexamination Certificate
active
07040526
ABSTRACT:
A method for assembling and testing an electronic circuit baseboard includes at least a step of soldering at least one electronic part to an electronic circuit baseboard using Pb excluded solder. One of erroneous wiring, erroneous mounting, malfunction, and defective soldering of the least one electronic part is tested by contacting a probe pin to various probe pin contact sections on the electronic circuit baseboard. During the step of soldering, the Pb excluded solder is also supplied to at least one of the various probe pin contact sections in order to suppress oxidation thereof.
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Mukai Katsuhiko
Nakagawa Hiromitsu
Negishi Takashi
Johnson Jonathan
Oblon & Spivak, McClelland, Maier & Neustadt P.C.
Ricoh & Company, Ltd.
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