Electronic parts and process for the manufacture of the same

Details Electronic parts and process for the manufacture of the same Electronic parts and process for the manufacture of the same

1986-07-07

1987-12-22

Robinson, Ellis P.

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

106 114, 106 118, 106 119, 4273762, 428148, 428210, 428325, 428328, 428403, 428404, 428469, 428472, 428688, 428704, 428454, B32B 516, B05D 302

Patent

active

047146451

ABSTRACT:
Electronic parts comprising ceramic substrate and electrode layer provided onto the substrate in which a micro-granular ceramic powder is dispersed substantially only inside of the electrode layer. A process for the manufacture of the same is also disclosed.

REFERENCES:
patent: 2788460 (1957-04-01), De Santis et al.
patent: 2833676 (1958-05-01), Heibel et al.
patent: 2993815 (1961-07-01), Treptow
patent: 3343985 (1967-09-01), Vickery
patent: 3708728 (1973-01-01), Sterling et al.
patent: 3873351 (1975-03-01), Ueda et al.
patent: 3874899 (1975-04-01), Miszenti et al.
patent: 4053864 (1977-10-01), Rodrigruez et al.
patent: 4098188 (1978-07-01), Stroszynski
patent: 4187328 (1980-02-01), Jumel
patent: 4251275 (1981-02-01), Deffeyis et al.
patent: 4309458 (1982-01-01), Kawasumi et al.
patent: 4353951 (1982-10-01), Yukitoshi et al.
patent: 4419279 (1983-12-01), Abrams
patent: 4485153 (1984-11-01), Janikowski et al.
patent: 4496475 (1985-01-01), Abrams

Affiliated with

Also associated with

Rating

Electronic parts and process for the manufacture of the same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electronic parts and process for the manufacture of the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electronic parts and process for the manufacture of the same will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-818464