Electronic parts

Stock material or miscellaneous articles – All metal or with adjacent metals – Composite; i.e. – plural – adjacent – spatially distinct metal...

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428641, 428642, H01L 2943

Patent

active

057099588

ABSTRACT:
An electronic part comprising an amorphous thin film formed on a substrate; and a metal wiring formed on the surface of the amorphous thin film; wherein an interatomic distance corresponding to a peak of halo pattern appearing in diffraction measurement of the amorphous thin film approximately matches with a spacing of a particular crystal plane defined with the first nearest interatomic distance of the metal wiring. An electronic part provided with a metal wiring formed of highly orientated crystal wherein half or more of all grain boundaries are small angle grain boundaries defined by one of grain boundaries with a relative misorientation of 10.degree. or less in tilt, rotation and combination thereof around orientation axes of neighboring crystal grains; coincidence boundaries where a .SIGMA. value is 10 or less; and grain boundaries with a relative misorientation of 3.degree. or less from the coincidence boundary. A method for manufacturing an electronic part, comprising the step of depositing a conductor layer which is mainly formed of one selected from Al and Cu on a substrate via an insulative layer, a barrier layer, a contact layer or an amorphous thin film layer wherein one element selected from Ga, In, Cd, Bi, Pb, Sn and Tl is supplied before or during the deposition of the conductor layer.

REFERENCES:
patent: 4068022 (1978-01-01), Glick
patent: 4234654 (1980-11-01), Yatabe et al.
patent: 4249190 (1981-02-01), Cho
patent: 4352239 (1982-10-01), Pierce
patent: 4742014 (1988-05-01), Hooper et al.
patent: 4942451 (1990-07-01), Tamaki et al.
patent: 4965656 (1990-10-01), Koubuchi et al.
patent: 4970574 (1990-11-01), Tsunenari
patent: 5011732 (1991-04-01), Takeuchi et al.
patent: 5051812 (1991-09-01), Onuki et al.
patent: 5110637 (1992-05-01), Ando et al.
patent: 5187561 (1993-02-01), Hasunuma et al.
patent: 5233217 (1993-08-01), Dixit et al.
patent: 5296297 (1994-03-01), Servais et al.
patent: 5339435 (1994-08-01), Ando et al.
patent: 5409862 (1995-04-01), Wada et al.
patent: 5498909 (1996-03-01), Hasunuma et al.
"Microstructure and Magnetic Properties of CoCr Thin Films Formed on Ge Layer", Futamoto et al., IEEE Transactions on Magnetics, vol. MAG-21, No. 5, pp. 1426-1428, Sep. 1985.
"Electromigration Characteristics of Vias in Ti:W/ALcu (2st%) Multilayered Metallization", J. May, IEEE Reliability Physics 1991 No Month, Cat No. 91CH2974-4.
"A Quarter-Micron Interconnection Technology Using Al-Si-Cu/TiN Alternated Layers", T. Kikkawa, et al., IEEE Int'l Electron Devices Meeting (1991) No Month.
Tungsten/Titanium Nitride Low-Resistance Interconnections Durable for High Temperature Processing, Nakasaki et al., Journal of Applied Physics (1988) No Month.
Electromigration Phenomena in Al-Si and Al-V-Si Thin Alloy Films, P. Van Engelen et al., Thin Solid Films, pp. 999-1007 (1990) No Month.
Studies of the Interaction Between Aluminum and Nickel, Chromium Andrnated Nichrome Alloy Films, A Gershiniski, Thin Solid Films, pp. 171-181 (1988) No Month.
A Candidate for Interconnection Material, Al-Y Alloy Thin Films, Y. Ki Lee, et al., Materials Letters, vol. 10, No. 7,8, pp. 344-347 (1991) No Month.
Hideaki Shimamura et al., "Microstructure of Sputter-Deposited Al-Cu-Si Films"; May, 1991; Journal of Vacuum Science Technology: Part A; vol. 9, No. 3, Part 1, pp. 595-599.
H. Shibata et al., "Influence of Under-Metal Planes on Al(111) Crystal Orientation in Layerd A1 Conductors"; May 28,1991; Proceedings of the Symposium on VLSI Technology; OISO; No. Symp. 11; Institute of Electrical and Electrtonics Engineers; pp. 33-34.

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