Electronic part with a lead frame

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type

Reexamination Certificate

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Details

C174S050510, C257S693000

Reexamination Certificate

active

06858800

ABSTRACT:
An electronic component comprises an upper half housing segment and a lower half housing segment. A lead frame to be bent downward toward the lower housing segment projects laterally from an upper end portion of the lower housing segment. Projecting from a side wall upper end portion of the lower housing segment is a rib piece in contact with the lower surface of base end portion of the lead frame and plastically deformable when subjected to a bending force to be applied to the base end portion when the lead frame is bent.

REFERENCES:
patent: 3735214 (1973-05-01), Renskers et al.
patent: 4195193 (1980-03-01), Grabbe et al.
patent: 4465898 (1984-08-01), Orcutt et al.
patent: 4706811 (1987-11-01), Jung et al.
patent: 5281851 (1994-01-01), Mills et al.
patent: 5285104 (1994-02-01), Kondo et al.
patent: 5471097 (1995-11-01), Shibata

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