Electronic part of surface mounted type and its mounting method

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type

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361807, H05K 506

Patent

active

053827546

ABSTRACT:
A central region of the bottom surface of a resin in which a diode chip and a base end portion of each of two lead terminals electrically connected to the chip is burning-treated by irradiating a laser beam in order to remove fat and oil existing in the bottom surface. Thereby, the deterioration of adhesive strength of an adhesive agent for fixing the bottom surface of the resin to a circuit board is prevented.

REFERENCES:
patent: 4339785 (1982-07-01), Ohsawa
patent: 4654290 (1987-03-01), Spanjer
patent: 4752668 (1988-06-01), Rosenfield
patent: 5248990 (1993-09-01), Ishiyawa et al.
patent: 5313365 (1994-05-01), Pennisi et al.

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