Electronic part mounting substrate, electronic part, and...

Details Electronic part mounting substrate, electronic part, and... Electronic part mounting substrate, electronic part, and...

2005-08-30

2005-08-30

Ngo, Hung V. (Department: 2831)

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

C174S260000, C174S264000

Reexamination Certificate

active

06936769

ABSTRACT:
An infrared emissive first insulating portion, which radiates heat transferred from a WCSP corresponding to an electronic part to a first conductive portion as infrared radiation with high efficiency, is formed on the first conductive portion lying in a through hole provided in a printed wiring board with the WCSP mounted thereon.

REFERENCES:
patent: 6555208 (2003-04-01), Takada et al.
patent: 6555762 (2003-04-01), Appelt et al.
patent: 2004/0211594 (2004-10-01), Ho et al.
patent: 2004/0238211 (2004-12-01), Momokawa et al.
patent: 10-125834 (1998-05-01), None
patent: 10-279845 (1998-10-01), None
patent: 11-067998 (1999-03-01), None

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