Electronic part mounting substrate and method for producing...

Details Electronic part mounting substrate and method for producing... Electronic part mounting substrate and method for producing...

2006-11-29

2011-10-18

Norris, Jeremy (Department: 2835)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S252000, C174S257000, C361S748000

Reexamination Certificate

active

08039757

ABSTRACT:
An electronic part mounting substrate has a ceramic substrate, a metal member bonded to one side of the ceramic substrate, a metal plate of aluminum or an aluminum alloy, one side of the metal plate being bonded directly to the other side of the ceramic substrate, and an electronic part bonded directly to the other side of the metal plate.

REFERENCES:
patent: 4459607 (1984-07-01), Reid
patent: 4700273 (1987-10-01), Kaufman
patent: 5130498 (1992-07-01), Yoshida et al.
patent: 5381304 (1995-01-01), Theroux et al.
patent: 6426154 (2002-07-01), Naba et al.
patent: 2002-76551 (2002-03-01), None

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