Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2007-01-09
2007-01-09
Arbes, Carl J. (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S832000, C438S107000, C438S108000
Reexamination Certificate
active
10925640
ABSTRACT:
In a method for producing an electronic part mounting substrate wherein a heat sinking metal base plate12is bonded to one side of a ceramic substrate10, and one side of a circuit forming metal plate14is bonded to the other side thereof, an electronic part16being mounted on the other side of the circuit forming metal plate14, the ceramic substrate10and the electronic part16are arranged in a mold so that the ceramic substrate10is spaced from the electronic part16, and then, a molten metal is injected into the mold so that the molten metal contacts both sides of the ceramic substrate10and the electronic part16. Then, the mold is cooled to solidify the molten metal, to form a heat sinking metal base plate on one side of the ceramic substrate10so that the heat sinking metal base plate is bonded directly to the one side of the ceramic substrate10, and to form a circuit forming metal plate on the other side of the ceramic substrate10so that one side of the circuit forming metal plate is bonded directly to the other side of the ceramic substrate10. When the circuit forming metal plate is formed, the electronic part is bonded directly to the other side of the circuit forming metal plate.
REFERENCES:
patent: 6440774 (2002-08-01), Kobayashi et al.
patent: 2002/0041023 (2002-04-01), Sakamoto et al.
patent: 2002-76551 (2002-03-01), None
Arbes Carl J.
Bachman & LaPointe P.C.
Dowa Mining Co. Ltd.
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