Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1996-09-30
1998-10-13
Picard, Leo P.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
361760, 361761, 361736, 361790, 361807, 361809, 361820, 257684, 257686, 257687, 257700, 257736, 257730, 257710, 257713, 174250, 174 521, 174 522, 174 523, 439591, H05K 118
Patent
active
058221948
DESCRIPTION:
BRIEF SUMMARY
TECHNICAL FIELD
The present invention relates to an electronic part mounting device having an appropriate flexibility, the durability of which is high, and further the cost of which is low.
BACKGROUND ART
Concerning an electronic part mounting device represented by an IC card, it is conventionally required that the electronic part accommodated in the device, such as a semiconductor chip and a wire coil, can be sufficiently protected and the electronic part mounting device is appropriately flexible and durable.
(1) The Unexamined Japanese Patent Application Publication No. Hei. 4-286697 discloses a personal IC card of high-performance characterized in that: both the size and the flexibility of the IC card meet the requirements of ISO Standard; a semiconductor chip accommodated in the IC card can be sufficiently protected; the IC card is embossable; the durability of the IC card is high; the cost of the IC card is low; and it is easy to manufacture the IC card. The IC card comprises: a circuit board made of polyester film that has been heat-stabilized, the length and the width of which are the same as those of the final product of the IC card; a structural member having an opening, made to adhere onto an upper surface side of the circuit board with a thermoplastic adhesive agent, the softening point of which is lower than that of the film, the length and the width of which are the same as those of the circuit board, the structural member being made of the same resin material as that of the structural circuit board; electronic parts received in the opening and attached onto the circuit board; and an encapsulant layer, the rigidity of which is greater than that of the structural member, wherein the encapsulant is charged into the opening so as to seal the electronic part.
(2) The Unexamined Japanese Patent Application Publication Nos. Sho. 60-252992, Sho. 61-208188 and Hei. 3-166740 disclose an IC card made of thermoplastic resin (polycarbonate resin), wherein the IC card is prevented from warping by a structure in which inner sheets of the same thickness, made of the same material, are symmetrically arranged on both sides of a core sheet, and further cover sheets are also symmetrically arranged on both sides of the core sheet, so that the thermal stress can be well balanced.
(3) The Unexamined Japanese Patent Application Publication No. Sho. 62-27195 discloses the following IC card for the purpose of providing a sufficiently high mechanical strength and flexibility with respect to bending. In the IC card, an IC module is embedded in the base material of the card, and the IC module includes a reinforcing member protruding in the direction of an outer circumference of the IC module.
(4) In order to enhance the reliability of an IC card in the event that bending stresses are given to the IC card, The Unexamined Japanese Patent Application Publication No. Hei. 2-235699 discloses an IC card including a means for enhancing an adhering force between an encapsulant layer to encapsulate an electronic part and a circuit board having a conductive pattern, and the means includes a plurality of holes formed close to a mounting section of the electronic part on the circuit board, and a portion of the encapsulant which covers the electronic parts is injected into the holes.
In the case of the IC card described in item (1), a sheet of polyester resin film used on the IC card is made by means of drawing. Accordingly, it has a characteristic that the thinner the sheet of polyester resin film is, the lower the degree of thermal shrinkage and expansion becomes.
Accordingly, even when sheets of polyester resin film are used which have been subjected to heat-stabilization before adhesion, when a relatively thick (about 350 .mu.m thickness) sheet of film used for the structural member is made to adhere onto a thin sheet of film used for the circuit board, the joined body warps in the process of manufacturing an IC card. Therefore, it is difficult to manufacture the IC card.
The IC card described in item (2) is less susceptible
REFERENCES:
patent: 5468999 (1995-11-01), Lin et al.
patent: 5583378 (1996-12-01), Marrs et al.
patent: 5609889 (1997-03-01), Weber
patent: 5613033 (1997-03-01), Swamy et al.
Horiba Yasuhiro
Kohmura Toshimi
Foster David
Ibiden Co. Ltd.
Picard Leo P.
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