Electronic part mounting construction and method for manufacturi

Details Electronic part mounting construction and method for manufacturi Electronic part mounting construction and method for manufacturi

1982-07-30

1985-07-02

Grimley, A. T.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

357 74, H05K 506

Patent

active

045270104

ABSTRACT:
An electronic part mounting construction, such as a transistor package or a substrate for a resin mold device, has a substrate for mounting an electronic part on a principal surface, at least one metallized layer deposited on the principal surface and soldered to the electronic part thereon, another metallized layer continuously extended from the at least one metallized layer in a direction perpendicular thereto, and an insulator layer deposited on the other metallized layer. The other metallized layer is provided on a side surface of a wall member or the substrate. The other metallized layer and the insulator layer may be formed by steps of forming a hole in an insulator sheet, depositing a metallized layer and an insulator layer successively on the surface of the hole, and leaving the metallized layer and the insulator layer at predetermined region(s) by punching the insulator sheet.

REFERENCES:
patent: 3349481 (1967-10-01), Karp
patent: 3681513 (1972-08-01), Hargis
patent: 4147889 (1979-04-01), Andrews et al.

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