Electronic part mounting board and semiconductor device using th

Details Electronic part mounting board and semiconductor device using th Electronic part mounting board and semiconductor device using th

1993-03-31

1994-03-29

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361736, 361774, 361776, 257666, 439 68, 29827, H05K 718

Patent

active

052990974

ABSTRACT:
An electronic part mounting board and a semiconductor device which may be easily fabricated and have high reliability by preventing deterioration due to heat at the time of fabrication and the occurrence of internal stress. In the electronic part mounting board and the semiconductor device using such electronic part mounting device: a board fixing pin is provided on a lead frame which is provided to surround a circuit board and which has a plurality of leads, in a manner extended from the frame to be coupled to the circuit board to support the circuit board with respect to the frame; and the circuit board and the board fixing pin are coupled to each other by a fitting pin for connecting the two members. Since the circuit board and the lead frame are coupled, heating and caulking are not required. The thermal deterioration of the resin board to be used and internal stress due to heat between the board and the lead frame do not occur. Fault at the time of mounting the electronic part and reduction in the reliability of the finished products are not caused. Since the coupling position may be selected with relatively less restrictions, the degree of freedom of design is large.

REFERENCES:
patent: 4714952 (1987-12-01), Takekawa
patent: 4827376 (1989-05-01), Voss
IBM Technical Disclosure Bulletin, Cochran et al, Microcircuit Having Printed Terminals, Apr. 1966, pp. 1483-1484, vol. 8, No. 11.

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