Electronic part mounting board and method of manufacturing the s

Details Electronic part mounting board and method of manufacturing the s Electronic part mounting board and method of manufacturing the s

1990-11-09

1992-06-23

Picard, Leo P.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

361386, 361388, 165185, 357 81, 174 163, H05K 720

Patent

active

051248840

ABSTRACT:
An electronic component mounting board includes a substrate having an electronic component mounting opening formed in an upper surface thereof and a recess provided on a rear surface thereof larger in size than the electronic component mounting opening; a heat radiating plate fixed to the recess by bonding material with a position of an upper surface of that heat radiating plate exposed to the electronic component mounting opening; an exposed depression extending over the substrate and the heat radiating plate at a position where a side wall of the recess and a side wall of the heat radiating plate confront each other and having a part of the bonding material exposed flush with a bottom surface thereof; and a metal plating layer continuously covering in sequence a lower surface of the heat radiating plate, a surface of the exposed depression and a rear surface of the substrate. A method of manufacturing the aforesaid electronic component mounting board is also set forth.

REFERENCES:
patent: 4322778 (1982-03-01), Barbour et al.
patent: 4561011 (1985-12-01), Kohara et al.
patent: 4737395 (1988-04-01), Mabuchi et al.
patent: 4739448 (1988-04-01), Rowe et al.
patent: 4773955 (1988-09-01), Mabuchi et al.
patent: 4835598 (1989-05-01), Higuchi et al.

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