Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate
1998-04-29
2001-10-16
Gaffin, Jeffrey (Department: 2841)
Electricity: conductors and insulators
Conduits, cables or conductors
Preformed panel circuit arrangement
C174S255000, C174S262000
Reexamination Certificate
active
06303873
ABSTRACT:
TECHNICAL FIELD
The present invention relates to an electronic part module and a process for manufacturing the same, for example, an IC chip module and the like suitable for use in an IC card wherein a bump formed on the electronic part, for example, an IC chip and the like, is connected to a connection pattern formed on a surface of a circuit board, and wherein the electronic part is bonded and fixed onto the circuit board. More specifically, the present invention relates to an electronic part module and a process for manufacturing the same, wherein a thermoplastic resin is used as the substrate of the circuit board.
BACKGROUND ART
Heretofore, in a thin card with a built-in IC chip, for example, an IC card, various IC chip modules in which connection terminals of an IC chip is connected to a connection pattern of a circuit board are utilized. In this type of IC chip modules, the IC card itself is not so expensive. Accordingly, since the IC chip modules must be manufactured as cheap as possible, a single-sided board having a connection pattern formed on one side of the circuit board is utilized and the IC chip is generally bonded and fixed on another side of the single-sided board. Various processes for bonding and fixing the IC chip to the circuit board and for electrically connecting connection terminals of the IC chip and the connection pattern of the circuit board have been proposed.
In a conventional IC chip module, referring to FIG.
7
through
FIG. 9
, a process for bonding and fixing an IC chip and a circuit board, and a process for electrically connecting connection terminals of an IC chip and a connection pattern of a circuit board will be explained.
FIG. 7
is a side view showing one example of a conventional IC chip module. The IC chip module
100
utilizes a board made from a thermosetting resin as a substrate
101
. An IC chip
106
is bonded to the substrate
101
by an adhesive
105
. In order to electrically connect connection terminals of the IC chip
106
and a connection pattern
103
, after exposing the connection pattern
103
by forming connection holes
107
in the substrate
101
of the circuit board
104
, the connection terminals of the IC chip
106
and the connection pattern
103
are electrically connected via wires
108
.
FIG. 8
is a side view showing another example of a conventional IC chip module. The IC chip module
110
utilizes a board made from a thermosetting resin as a substrate
111
. In order to electrically connect connection terminals of the IC chip
116
and a connection pattern
113
, after exposing the connection pattern
113
by forming connection holes
117
in the substrate
111
of the circuit board
114
, solder bumps B and the connection pattern
113
are electrically connected by solder in the connection holes
117
. In order to bond the IC chip
116
to the substrate
111
, an adhesive
115
is applied to a periphery of the IC chip
116
after the solder bumps B and the connection pattern
113
are electrically connected as described above.
Further,
FIG. 9
is a side view showing the other example of a conventional IC chip module. The IC chip module
120
utilizes a board made from a thermosetting resin as a substrate
121
. In order to electrically connect connection terminals of an IC chip
126
and a connection pattern
123
, and in order to bond the IC chip
126
to the substrate
121
, the connection pattern
123
is exposed by forming connection holes
127
in the substrate
121
of the circuit board
124
. After electric conductive paste
128
is applied in the connection holes
127
, bumps B are positioned and the electric conductive paste
128
is thermoset. Accordingly, the bumps B and the connecting pattern
113
are electrically connected. Then, the IC chip
126
is bonded to the circuit board
124
by applying a thermosetting adhesive
125
to a periphery of the IC chip
126
and by thermosetting the adhesive
125
.
However, in each of the above described conventional IC chip modules
100
,
110
,
120
, a thermosetting resin such as a glass-epoxy resin is utilized as a substrate
101
,
111
,
121
of the circuit board
104
,
114
,
124
. Generally, the thermosetting resin is expensive. Accordingly, the problem arises in that the costs of the IC chip modules
100
,
110
,
120
is increased.
Further, in order to connect the connection terminals of the IC chips
106
,
116
,
126
and the connection patterns
103
,
113
,
123
, the connection holes
107
,
117
,
127
must be formed in the substrate
101
,
111
,
121
. Accordingly, the processes for manufacturing the conventional IC chip modules
100
,
110
,
120
become complicated and the costs are increased because a connection hole forming process is required.
Furthermore, in order to bond and fix the IC chips
106
,
116
,
126
onto the circuit boards
104
,
114
,
124
, adhesives
105
,
115
,
125
are additionally required. Accordingly, the costs of the IC chip modules
100
,
110
,
120
are increased in accordance with the amount of the adhesives
105
,
115
,
125
.
The present invention has been made in order to solve the above described prior problems. An object of the present invention is to provide an inexpensive electronic part module and a process for manufacturing the same wherein an inexpensive thermoplastic resin is used as the substrate of the circuit board, the connection holes need not be formed in the substrate when the bumps of the electronic part such as an IC chip and the like are electrically connected to the connection pattern, and the substrate itself is utilized as an adhesive.
DISCLOSURE OF THE INVENTION
To achieve the object, an electronic part module according to claims
1
and
2
includes the following: a circuit board having a substrate formed from a thermoplastic resin, and a connection pattern provided on one surface of the substrate; an electronic part such as an IC chip and the like provided with a bump; the bump being passed through the substrate and connected to the connection pattern with pressure; and the electronic part being bonded to the substrate at least at a periphery of the bump through the substrate which is hardened after melted.
In the electronic part module including the above-mentioned structure according to claims
1
and
2
, since a substrate of a circuit board is formed from a thermoplastic resin which is generally cheaper than a thermosetting resin, the cost of an electronic part module can be suppressed at a low level by reducing the cost of the substrate. Further, since a solder bump is passed through the substrate by pressing the electronic part from a side of another surface of the substrate in a state that the electronic part is heated to a temperature higher than a melting point of the thermoplastic resin and lower than a melting point of the solder bump, a connecting hole is not necessary in order to connect the bump and the connection pattern. Accordingly, it is possible to reduce a cost for manufacturing the electronic part module. Furthermore, since the electronic part is bonded to the substrate at least at a periphery of the bump through the thermoplastic resin of the substrate which is hardened after melted upon heating, an adhesive is not necessary when the electronic part is bonded to the substrate. Accordingly, in this point, it is also possible to reduce the cost of the electronic part module.
Further, an electronic part module according to claim
3
has a structure that, in the electronic part module according to claim
1
or claim
2
, an anchoring surface is formed on a connection pattern's one side which contacts with the substrate and the bump is connected to the connection pattern via the anchoring surface. In the electronic part module according to claim
3
, anchoring processing is performed on a copper foil's surface which is bonded to the substrate which is a base for forming a connection pattern. It becomes possible that the reliability of the electrical connection between the bump and the connection pattern is improved because it is skillfully utilized
Kohmura Toshimi
Mori Mikio
Gaffin Jeffrey
Ibiden Co. Ltd.
Norris Jeremy
Oblon & Spivak, McClelland, Maier & Neustadt P.C.
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