Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Wire contact – lead – or bond
Reexamination Certificate
2008-03-25
2008-03-25
Jackson, Jerome (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Wire contact, lead, or bond
C257S734000, C257S773000, C257S774000, C257S775000, C257S776000
Reexamination Certificate
active
11247610
ABSTRACT:
A method for manufacturing an electronic part, including: cutting a wiring substrate, which contains a base substrate, a wiring pattern provided on a first surface of the base substrate, and a reinforcing member provided on a second surface of the base substrate, along a line intersecting with an outer circumference of the reinforcing member; wherein a wire, out of a plurality of wires composing the wiring pattern, arranged closest to an intersecting point of the outer circumference of the reinforcing member and the line has a widest width.
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Communication from the Japanese Patent Office regarding corresponding application.
Harness & Dickey & Pierce P.L.C.
Jackson Jerome
Seiko Epson Corporation
Valentine Jami M
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