Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Reexamination Certificate
2011-01-25
2011-01-25
Harvey, James (Department: 2833)
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
C439S078000, C439S060000
Reexamination Certificate
active
07874847
ABSTRACT:
Electrical connection is established by bringing solder bumps formed as electrical connecting terminals of an electronic part and spiral contactors formed as electrical contactors of a circuit substrate into contact with each other. The solder bumps are formed such that heights thereof relative to a surface on which the solder bumps are formed are different from each other.
REFERENCES:
patent: 4124877 (1978-11-01), Vollenweider
patent: 6517362 (2003-02-01), Hirai et al.
patent: 6887085 (2005-05-01), Hirai
patent: 7080993 (2006-07-01), Yoshida et al.
patent: 7137831 (2006-11-01), Okamoto et al.
patent: 7380337 (2008-06-01), Soeta
patent: 7530814 (2009-05-01), Ramaswamy et al.
patent: 7564130 (2009-07-01), Li
patent: 7628616 (2009-12-01), Yoshida et al.
patent: 2002/0013010 (2002-01-01), Maruyama et al.
patent: 2002/0037657 (2002-03-01), Hirai et al.
patent: 2003/0060064 (2003-03-01), Hirai et al.
patent: 2004/0185694 (2004-09-01), Hirai
patent: 2008/0018423 (2008-01-01), Matsui et al.
patent: 10-041025 (1998-02-01), None
patent: 11-040713 (1999-02-01), None
patent: 2000-340709 (2000-12-01), None
patent: 2001-068594 (2001-03-01), None
patent: 2002-5992 (2002-01-01), None
patent: 2002-175859 (2002-06-01), None
patent: 3440243 (2003-06-01), None
patent: 2004-234872 (2004-08-01), None
patent: 2004-327182 (2004-11-01), None
International Search Report PCT/JP2005/005030 dated Jun. 14, 2005.
Matsui Jun
Nobuhara Hiroyuki
Terada Koji
Fujitsu Limited
Harvey James
Staas & Halsey , LLP
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