Communications: radio wave antennas – Antennas – Microstrip
Reexamination Certificate
1999-04-14
2001-09-18
Wong, Don (Department: 2821)
Communications: radio wave antennas
Antennas
Microstrip
C430S315000
Reexamination Certificate
active
06292139
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to an electronic part to be used for various purposes, for example, such as dielectric antennas and coil parts and a method of manufacturing such electronic part, and more particularly to an electronic part using composite materials made up of synthetic resin and ceramic powder as a functional material and a method of manufacturing such electronic part.
2. Description of the Related Art
Ceramics and synthetic resin have been widely used as materials constituting electronic parts.
However, when ceramics is used, it was difficult to easily obtain electronic parts which are not uniform in shape because the electronic parts are formed by firing. For example, in Japanese Unexamined Utility Model Publication No. 5-55529, an electronic part made up of ceramics and having a three-dimensional form is shown. These use a sintered ceramic material in which a portion requiring plating is composed of a ceramic material having a catalytic action so that the portion is able to be plated and a portion not requiring plating is composed of a ceramic material not allowing plating. Therefore, even if a sintered material of a complicated three-dimensional shape is used, it is understood to be able to form electrodes in required portions by electroless plating without fail. Further, it is indicated that capacitors, etc. are able to be formed on a three-dimensional circuit board by making use of the dielectric constant of ceramics. However, because ceramics is used, complicated processes were required to realize the three-dimensional shape, and the dimensional overall accuracy of the three-dimensional electronic part thus obtained was not sufficient.
On the other hand, a method of manufacturing three-dimensional circuit boards using synthetic resin has been proposed. For example, Japanese Unexamined Patent Publication No. 63-128181 and Japanese Patent No. 2603828, disclose a method of obtaining three-dimensional circuit boards in such a way that a molded product is obtained through two molding processes by using resin containing a catalytic agent such as palladium so as to be plated and resin not allowing plating and on the molded product electrodes are formed by a photolithography or a common method of plating. By these methods, it is possible to obtain highly precise circuit boards of a three-dimensional shape as the synthetic resin is excellent in moldability. However, these three-dimensional circuit boards using the synthetic resin were used only to support conductive paths, and the electrical properties of the synthetic resin such as dielectric constant, permeability, etc. were not used in a positive way.
Further, Japanese Unexamined Patent Publication No. 3-4581, discloses a composite circuit of a board integrally formed by using composite resin materials of synthetic resin with ceramic powder dispersed therein. The board is composed of a first part made up of composite materials of resin with dielectric ceramic powder dispersed therein, and a second part made up of composite materials of resin with magnetic ceramic powder dispersed therein, that is, the board is constructed so as to have first and second parts which have electrical properties different from each other. The composite circuit is realized by first and second circuit elements which are composed of the first and second parts. However, the first and second circuit elements are only made up of the first and second parts, respectively.
That is, so far chip-type electronic parts making use of the electric properties and having easy moldability of synthetic resin has not been known.
SUMMARY OF THE INVENTION
An object of the present invention is to present a new electronic part making use of not only the easy moldability, but also the electrical properties of synthetic resin and a method of manufacturing such electronic part.
The present invention provides an electronic part, comprising an electronic-part body comprising: a composite-material body made of synthetic resin in which ceramic powder as a functional material and a catalytic agent to make plating practicable are dispersed; and a layer of composite material of synthetic resin in which ceramic powder as a functional material is dispersed, said layer covering the external surface of said composite-material body except a portion in which an electrode is to be disposed; and an electrode disposed on the external surface of said electronic-part body.
According to the above described structure and arrangement, as the electronic part is made up of composite material of synthetic resin with functional ceramic powder or whisker dispersed therein, the electronic part is able to be made lightweight, and at the same time as the composite materials are excellent in moldability, electronic parts being excellent in their dimensional accuracy and having various forms are able to be easily obtained. Accordingly, electronic parts different in shape are able to be easily presented. Further, by adjustment of the kinds and mixing ratio of the above-mentioned synthetic resin and ceramic powder as a functional material or whisker, the desired electrical properties are able to be easily realized.
Compared with electronic parts using conventional sintered ceramic material, electronic parts having various shapes and electrical properties are able to be easily presented when required.
In the above described electronic part, said ceramic powder as a functional material may be selected from the group consisting of dielectric ceramic powder and magnetic ceramic powder.
According to the above described structure and arrangement, a dielectric ceramic powder or magnetic ceramic powder is used as the ceramic powder of a functional material. Accordingly when, for example, dielectric ceramic powder is used, it is possible to present capacitors and dielectric antennas. When a magnetic ceramic powder is used, it is possible to present coil parts and other parts.
Said electronic part may be made up of synthetic resin in which dielectric ceramic powder is dispersed, and a plurality of said electrodes are disposed on the external surface of said electronic-part body to thereby said electronic part constitutes a dielectric antenna. According to the above structure and arrangement, a dielectric antenna which is lightweight and highly dimensionally accurate and has desired characteristics is able to be easily presented.
Said electronic part may be made up of synthetic resin in which a magnetic ceramic powder is dispersed, and said electrode is disposed on the external surface of said electronic-part body to thereby constitute a coil part. According to this above described structure and arrangement, the coil part which is lightweight and excellent in dimensional accuracy and the desired inductance is able to be easily presented.
The present invention further provides a method of manufacturing an electronic part, comprising the steps of: obtaining a primary molded product made up of synthetic resin in which ceramic powder as a functional material and a catalytic agent to make plating practicable are dispersed; obtaining a secondary product by forming a layer of composite material of synthetic resin in which ceramic powder as a functional material is dispersed so as to cover a portion of the external surface of the primary molded product except the portion in which an electrode is to be formed; and plating the portion of the secondary molded product except the portion in which the layer of composite material is formed, and forming an electrode thereon.
According to the above described method, when on the external surface of the secondary molded product electrodes are formed by plating, the layer of composite materials is not able to be plated and acts as a mask and accordingly, electrodes are able to be easily and securely formed on the portion in which the layer of composite materials is not formed. In consequence, each of the above described electronic parts of the present invention is able to be easily produced.
In the above described meth
Kushihi Yuichi
Yamaki Kazuhisa
Yamamoto Keizo
Clinger James
Murata Manufacturing Co. Ltd.
Ostrolenk Faber Gerb & Soffen, LLP
Wong Don
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